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Reflow Oven

Reflow Oven

Reflow Oven

Product Details:

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Detailed Product Description

Main specification:
Product Type: T-960
Number of heating zones: 3 / Down 2
Heating zone length: 960mm
Heating: hot + smart intelligent controlled level of controlled fast infrared heating
Number of cooling zones: 1
PCB maximum width: 300MM
Transport direction: Left → Right
Transmission: network transmission + chain drive
Conveyor belt speed: 0-1600mm / min
Power supply: 3-phase 5-wire 380V / 220V 50 / 60Hz
Power Peak power: 4.5KW
Warm-up time: 15 minutes
Temperature control range: room temperature ~ 300 ℃
Temperature control: PID loop control
Temperature control accuracy: ± 3 ℃
PCB board temperature distribution deviation: ± 2 ℃
Dimensions (L * W * H): 1450 × 630 × 470
Weight: 90KG







Product Features
1, The machine adopts intelligent controlled horizontal hot air + intelligent controlled fast infrared heating technology, with a special design wind wheel wind speed stability, temperature uniformity for new LED light source, the bulk of uninterrupted soldering BGA components;
2, the machine is equipped with crawler, five-zone heating system, independent of each temperature zone using forced circulation, independent PID control, upper and lower independent heating, the temperature of the furnace chamber accurate, uniform, large heat capacity, fast heating from room temperature to work temperature for 15 minutes;
3, intelligent curve heating, large capacity curve selection, with eight technology curve can meet the requirements of all types of welding processes;
4, programmable control technology, the preset memory function curve, according to your preset curve automate the entire welding process;
5, using thermocouple, and add a compensation circuit, so that a more accurate temperature measurement, so that the curve is more perfect;
6, PID intelligent temperature control technology, allowing more accurate temperature control, no import high current solid state relay contact output can effectively avoid rapid warming or heating caused by continuous chip or circuit board is damaged, the entire welding process more scientific and safety;
7. The transmission system adopts imported inverter motor, PID closed loop speed control, with 1: 150 imported turbine reducer, smooth operation, adjustable speed range 0-1600mm / min.
8. Using independent wheel structure and the care level, special stainless steel mesh belt B word, durable wear-resistant smooth operation, precise speed of up to ± 10mm / min;
9. independent cooling zones, to ensure that the low temperature required for the plate when the PCB board;
10, a friendly man-machine interface, perfect LCD without a PC connected with the whole heating process at a glance;
11, resolute appearance, compact size, reflected in technology-based start to finish. Mesa-type placement mode, so you have more space; the simple instructions, so you'll see.
Reflow machine instructions
1, after the boot into setting interface. Press F2 curve selection, press F1 conduct point selection, press F3 / F4 corresponding zone temperature setting on the up / down, press F5 to enter the heated interface;
Under 2, five small red switch 1/2/3/4/5 control the first temperature zone / warm zone on the first / second temperature zone / third temperature zone / area at a second temperature;
3, when the temperature reaches equilibrium, open the motor switch, and adjust the conveyor speed;
4, press F2 to stop heating, and enter the setup interface;
5, the factory, each temperature curve for the following purposes:
Curve 2 for less than leaded solder welding; eg: 85Sn / 15Pb 70Sn / 30Pb and so on;
Curves 3 and 4, is suitable for welding relatively large amount of lead solder; as: 63Sn / 37Pb 60Sn / 40Pb and the like;
Curves 5,6, suitable for welding of high melting point lead-free solder; such as: Sn / Ag3.5; Sn / Cu.75 Sn / Ag4.0 / Cu.5 Sn95.5 / Ag3.8 / Cu0.7 etc;
Curves 7-8 for solder melting point lead-free solder; such as: Sn / Ag2.5 / Cu.8 / Sb.5; Sn / Bi3.0 / Ag3.0 etc;
Recommended veneer welding cycle curve 1,3,5,7 480S, curve 2,4,6,8 recommend veneer welding cycle 280S.
6, to remind
①, welding chips, depending on the size and welding process requirements of the chip, select the appropriate curve.
Distribution ②, heating temperature zones for the upper three zones, the lower two zones, corresponding to the first paragraph of the heating curve / third / fourth paragraph / paragraph / fifth paragraph.
③, the current production and use of solder there are many, each company has chosen very different articles about theoretical analysis and test analysis very much. For these reasons, the company launched a product that can preset eight curves, each curve has five segments, each segment of the heating time can be changed. The user can re-set the heating curve according to the heating temperature and time required to solder.
Reflow profile settings based on
1. Principles and reflow temperature profile
           When the PCB entering the heating zone (drying zone), the solder paste, the solvent was evaporated off gas, while the solder paste flux wetting the pad, the tip member and the pin, the solder paste to soften, collapse, covering the weld disc, the pads, pins and oxygen element isolation; PCB into the holding area, so that PCB and components are fully preheat PCB to prevent excessive heating pads suddenly entered damaged PCB and components; when the PCB into the weld zone the temperature rose rapidly to reach a molten state so that the solder paste, liquid solder pads on the PCB, PCB component side into the cooling zone, so that solder solidification, complete reflow.
          Temperature profile is critical to ensure the quality of welding, heating slope and peak solder temperature and actual temperature curve temperature curve should be basically the same. 160 ℃ before heating rate controlled at about 1 ℃, if the ramp rate too fast, on the one hand to make components and PCB heat too fast, easy to damage components, could easily lead to PCB deformation; on the other hand, the solder paste is too volatile solvent fast, easy to spill metal components, produce solder balls. The peak temperature is generally set higher than the solder melts at a temperature of about 20 ℃ -40 ℃, reflux time of 10S-60S, low or reflow peak temperature short time, make welding insufficient cause severe paste does not melt; peak over high or long refluxing time, resulting in oxidation of the metal powder, affecting the quality of welding, and even damage to components and PCB.
2, the temperature curve settings
           Be set according to the temperature curve using solder paste and solder principles provided above. Different metal content of solder paste application of different temperature curve, according to the temperature profile of the solder paste manufacturers to provide a specific set reflow profile. Further, also with the temperature curve of the heating of the PCB, the density of components, size and so on. Under normal circumstances, lead-free soldering temperature should be higher than the melting point of about 40C.
Temperature zone settings
1. Set the zone temperature and belt speed (usually given when the manufacturer conditioners by) to the starting value.
2. For a cold furnace, is preheated for 20-30 minutes.
3, when the temperature reaches equilibrium, the sample was heated to reflux PCB system, which is set so that the critical point of solder paste to reflux. Should not happen by four reflux treatment reflux occurs when the excesses, to maintain the correct temperature setting minus the proportion of support, and let the PCB back through the system until the reflux critical point, turn to step 4 if and only if there is no or just reflux, whichever occurs .
4, if a reflux does not occur, the belt speed reducing 5-10%. For example: when the tape speed is not present at reflux for 500mm / min, is reduced to adjust 460mm / min or so. Belt speed 10% reduction in general will increase product reflux temperature of about 30F. Or belt speed without changing the premise, appropriately increasing the set temperature, increase the amplitude of the temperature curve has been the standard reference for the center, according to PCB through the gap between the magnitude of the actual temperature curve and standard curve adjustment system, generally about 5 ℃ for each adjustment gradient, adjusting the set temperature should pay special attention to not exceed the capacity of the PCB and components.
5, and then make the PCB board by reflow system on the new tape speed or set the temperature, with or without reflux occurs, turn the adjustment to redo step 4, otherwise go to step 6, the fine-tuning by the temperature curve.
6, by the complexity of the temperature curve with the PCB and make appropriate adjustments. You can fine-tune the tape speed two scale, lower belt speed will improve the product by the temperature, on the contrary increase the belt speed will be reduced by the product temperature.
7. Tip: Generally the PCB-mounted components after reflow system without fully reflux can be adjusted after the second into the return system for welding, usually does not cause an adverse impact on the PCB and components. 8, the temperature is set from low to high in general, if the amplitude exceeds the reflux temperature by the temperature is too large, the belt speed should be a corresponding increase or decrease to adjust the set temperature, in particular with four opposite operation.


Contact Details
Tianhe Filter Engineer Co.,Ltd

Contact Person: Mr. Danny Jiang

Tel: 86-13-262923213

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